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Harmonic silicon wafer precision FHA-25C-100-E250-C

Purchase Qty. / Reference FOB Price
1 piece US $
Production Capacity: 100
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Basic Info

The development results of the silicon wafers are tested. The qualified silicon wafers enter the subsequent etching process, and the unqualifiedHarmonic silicon wafer precision FHA-25C-100-E250-C silicon wafers enter the initial process after cleaning.
8) Etching
Etching is a process of selectively removing unnecessary materials from the surface of a silicon wafer through chemical or physical methods. Through etching, desired electronic devices can be built on the silicon wafer.

Schematic diagram of dry (physical)unqualifiedHarmonic silicon wafer precision FHA-25C-100-E250-C silicon wafers enter the initial process after cleaning. and wet (chemical) etching principles
Etching is divided into dry etching and wet etching. Dry etching exposes the surface of the silicon wafer to an inert gas. The plasma generated by the gas bombards the window opened by the photoresist and reacts with the silicon wafer to remove the exposed surface material. It is used to etch devices in sub-micron size.unqualifiedHarmonic silicon wafer precision FHA-25C-100-E250-C silicon wafers enter the initial process after cleaning. The main method. Wet etching uses liquid chemicals (acids, alkalis, organic solvents, etc.) to chemically remove materials on the surface of silicon wafers, and is generally only used for larger sizes.

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